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Navigation Grade MEMS Gyroscope Chip for UAV & Navigation

Shenzhen Fire Power Control Technology Co., LTD
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    Buy cheap Navigation Grade MEMS Gyroscope Chip for UAV & Navigation from wholesalers
     
    Buy cheap Navigation Grade MEMS Gyroscope Chip for UAV & Navigation from wholesalers
    • Buy cheap Navigation Grade MEMS Gyroscope Chip for UAV & Navigation from wholesalers
    • Buy cheap Navigation Grade MEMS Gyroscope Chip for UAV & Navigation from wholesalers
    • Buy cheap Navigation Grade MEMS Gyroscope Chip for UAV & Navigation from wholesalers
    • Buy cheap Navigation Grade MEMS Gyroscope Chip for UAV & Navigation from wholesalers
    • Buy cheap Navigation Grade MEMS Gyroscope Chip for UAV & Navigation from wholesalers
    • Buy cheap Navigation Grade MEMS Gyroscope Chip for UAV & Navigation from wholesalers

    Navigation Grade MEMS Gyroscope Chip for UAV & Navigation

    Ask Lasest Price
    Brand Name : Firepower
    Model Number : MGZ221HC
    Price : negotiable
    Payment Terms : T/T,L/C,Western Union
    Supply Ability : 100 pcs/month
    Delivery Time : 20 days for sample
    • Product Details
    • Company Profile

    Navigation Grade MEMS Gyroscope Chip for UAV & Navigation

    MEMS Gyroscope Chip for Inertial Measurement Unit

    Our MEMS gyroscope chip delivers high-precision angular rate sensing for advanced inertial navigation and motion control applications. Designed with aerospace-level reliability and industrial-grade durability, it provides ultra-low noise, low bias instability, and excellent temperature stability for platforms that require long-term accuracy and robust performance.

    Engineered for UAVs, autonomous robots, and industrial equipment, this MEMS gyro chip offers fast dynamic response, compact form factor, and low power consumption — making it ideal for embedded navigation systems and precision motion platforms.

    PCB Design Guidelines
    • Decoupling capacitors for pins VCP, VREF, VBUF, and VREG should be placed as close to the pins as possible with minimized trace resistance
    • Other ends of decoupling capacitors for VREF, VBUF, and VREG should connect to nearest AVSS_LN and then to signal ground via a magnetic bead
    • Decoupling capacitors for VCC and VIO must be placed close to corresponding pins
    • VCC operation requires about 35mA current - use wide PCB traces for voltage stability
    • Avoid routing under the package for smooth assembly
    • Position components away from stress concentration areas, heat sources, and mechanical contact points
    MEMS Gyroscope Chip PCB Layout Diagram
    Technical Specifications
    PerformanceUnitMGZ318HC-A1MGZ221HC-A4MGZ330HC-O1
    Rangedeg/s400400400
    Band Width @3DB customizedHz200200300
    Output accuracy(digital SPI)bits242424
    Output rate(ODR)(customized)Hz12K12K12K
    Delay(customized)ms<1.5<1.5<1
    Bias stabilitydeg/hr(1o)<0.1<0.5<0.1
    Bias stability (1σ 10s)deg/hr(1o)<1<5<1
    Bias stability (1σ 1s)deg/hr(1o)<3<15<3
    Bias error over temperature (1σ)deg/hr(1o)<10<3010
    Bias temperature variations, calibrated(1σ)deg/hr(1o)<1<10<1
    Bias repeatabilitydeg/hr(1o)<0.5<3<0.3
    Scale factor at 25°Clsb/deg/s160001600020000
    Scale factor repeatability (1σ)ppm(1o)<20ppm<20ppm<100ppm
    Scale factor vs temperature (1σ)ppm(1o)<100ppm<100ppm<300ppm
    Scale factor non-linearity (1σ)ppm<150ppm<150ppm<300ppm
    Angular random walk(ARW)°/√h<0.05<0.25<0.05
    Noise(Peak to Peak)deg/s<0.35<0.4<0.25
    GValue sensitivity°/hr/g<1<3<1
    Vibration rectification error(12gRMS,20-2000)°/hr/g(rms)<1<3<1
    Power-on time (valid data)s750m
    Sensor Resonant Frequencyhz10.5k-13.5K
    Environmental Specifications
    • Impact (power on): 500g, 1ms
    • Impact resistance (power off): 10000g, 10ms
    • Vibration(power on): 18g rms (20Hz to 2kHz)
    • Working temperature: -40℃ to +85℃
    • Store temperature: -55℃ to +125℃
    • Supply voltage: 5±0.25V
    • Current consumption: 45ma
    MEMS Gyroscope Chip Installation Diagram
    Installation Guidelines

    High-performance MEMS gyroscope is a high-precision test equipment. To achieve optimal design performance, consider these installation recommendations:

    • Evaluate sensor placement using thermal analysis, mechanical stress simulation (bending measurement/FEA), and impact robustness testing
    • Maintain appropriate distance from:
      • PCB thickness recommendations: 1.6-2.0mm to minimize inherent stress
      • Buttons/mechanical stress points
      • Heat sources (controllers, graphics chips) that may raise PCB temperature
    • Avoid placement in areas prone to mechanical stress, warping, or thermal expansion
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